Structural Bonding Films

Innovation in bonding with epoxy, cyanacrylate and polyurethan

Industry’s demands on hightech bonding systems are increasing. Today, numerous safety components or entire assemblies are optimally connected using only adhesives.In order to create connections that are reliable for the various processes, the limits of conventional pressure-sensitive adhesives have to be surpassed and compromises between product development and process optimisation need to be amplified.

With their new product range DuploTEC® SBF the Lohmann “Bonding Engineers” have provided the answer to these industrial challenges. Within the scope of structural bonding, innovative products that are much stronger than conventional pressure-sensitive adhesive connections have been developed.

DuploTEC® SBF is easy to handle, dimensional precise and pre-applicable. Thus, a fast and neat processing is guaranteed. Within the DuploTEC® SBF range Lohmann distinguishes between three different technologies that are referred to as “Topaz” (polyurethan), “Onyx” (epoxy) and “Amber” (cyanacrylate).

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Technology:

  • Polyurethane adhesive system with thermosetting properties
  • Solvent free, dry adhesive film
  • Latent reactive with structural bonding characteristics

Advantages:

  • Curing within seconds
  • Low curing temperatures
  • Optimally adjustable to the customer requirements
  • Individual and precise adhesive dimensions down to 0,3 mm width
  • Stays elastic & flexible after hardening
  • High heat - and chemical resistance

Process:

  • Pre-applicable between 60-70°C (140-158°F)
  • Storage stability even after pre-application
  • Hardens between 70-160°C (160-320°F)
  • Curing after 3 seconds possible
  • Pressure min. 15 N/cm²

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Technology:

  • First commercially available cyanoacrylate adhesive system as roll good
  • Bonding film with high immediate adhesion
  • Reactive with structural adhesive characteristics
  • Patent pending

Advantages:

  • Unites the advantages of adhesive tapes and liquid adhesives
  • As easy to apply as an adhesive tape
  • High initial tack allows safe & easy fixation
  • Well suitable for temperaturesensitive materials

Process:

  • Auto cure bonding at room temperature and humid conditions
  • Curing reached at 23 °C (74°F) after 48 h
  • Curing reached at 70 °C (160°F) after 1 h

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Technology:

  • Epoxy based thermosetting bonding film
  • Bonding film with initial adhesion
  • Reactive films and tapes with characteristics from flexible up to high structural bonding performances
  • Various formulations, thicknesses and coating technologies available

Advantages:

  • As easy to apply as an adhesive tape (tack at room temperature)
  • Compensation of high static and dynamic forces
  • Extremely resistant to ageing and chemicals
  • High temperature resistance

Process:

  • Curing between 130 -180 °C (260-360°F)
  • Curing after min. 10 min
  • Adaptable to individual process conditions
  • Pressure: min. 1 N/cm²

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Interested in finding out more?

Then contact us. We will be pleased to help.

Contact form Structural Bonding Films

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DuploTEC SBF Teaser en.pdf
DuploTEC SBF Teaser en.pdf

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01.12.2017