© Lohmann Technologies (UK) Ltd

© Lohmann Technologies (UK) Ltd


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Bondexpo - Trade Fair for Industrial Bonding Technology

Hall 7, Stand no.: 7519
Date:
08.10.2012 - 11.10.2012
City:
Stuttgart
Country:
Germany
Description:

In the year 2012, the 6th BONDexpo will be held at the Stuttgart Exhibition Centre from the 8th through the 11th of October.

BONDexpo will mediate the state-of-the-art and current know-how in the areas of R&D, actual use and materials application, and will point out new directions for the future of bonding, insulation, foaming, sealing and encapsulation technologies.

Hints:
Landesmesse Stuttgart GmbH || Messepiazza || 70629 Stuttgart

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